China Best quality Pu Binder For Mould Processing Product - Donpanel 423 CP/IP base blend polyols for continuous PIR – INOV Manufacturer and Supplier

Best quality Pu Binder For Mould Processing Product - Donpanel 423 CP/IP base blend polyols for continuous PIR – INOV

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Best quality Pu Binder For Mould Processing Product - Donpanel 423 CP/IP base blend polyols for continuous PIR – INOV Detail:

Donpanel 423 CP/IP base blend polyols for continuous PIR

INTRODUCTION

DonPanel 423 system is a four components system which consists of blend polyols, polymeric MDI, catalyst and blowing agent (pentane series). The foam has good thermal insulation property, light in weight, high compression strength and flame retardant and other advantages. It is widely used to produce continuous sandwich panels, corrugated panels etc, which applies to make cold stores, cabinets, portable shelters and so on.

PHYSICAL PROPERTY

K1-blend polyols DonPanel 423

Appearance	Light yellow to brown transparent liquid
OHvalue mgKOH/g	260-300
Dynamic viscosity（25℃） mPa.S	1800-2200
Density （20℃） g/ml	1.10-1.16
Storage temperature ℃	10-25
Storage stability month	6

K2-Polymeric MDI DD-44V80

Appearance	brown transparent liquid
NCO content %	30.50
Dynamic viscosity （25℃） mPa.S	600-700
Density （20℃） g/ml	1.24
Storage temperature ℃	10-25
Storage stability month	12

K3-Cat 2816

Appearance	Light yellow transparent liquid
Dynamic viscosity （25℃） mPa.S	1200-1600
Density （20℃） g/ml	0.96
Storage temperature ℃	10-25
Storage stability month	6

RECOMMENDED RATIO

Raw materials	pbw
DonPanel 423	100 g
Cat2816	1-3 g
Pentane (Cyclopentane/Isopentane)	7-10 g
Polymeric MDI DD-44V80	135-155 g

TECHNOLOGY AND REACTIVITY (the exact value varies depending on processing conditions)

Items	Manual mixing	High pressure machine
Raw material temperature ℃	20-25	20-25
Mould temperature ℃	45-55	45-55
Cream time s	10-15	6-10
Gel time s	40-60	40-60
Free density kg/m³	34.0-36.0	33.0-35.0

MACHINERY FOAM PERFORMANCES

Mold density	ISO 845	≥38kg/m³
Closed-cell rate	ASTM D 2856	≥90%
Thermal conductivity （15℃）	EN 12667	≤24mW/(m.K)
Compression strength	EN 826	≥120kPa
Adhesive strength	GB/T 16777	≥100kPa
Dimensional stability 24h -30℃	ISO 2796	≤0.5%
24h -100℃	ISO 2796	≤1.0%
Flame retardant grade	DIN 4102	Level B2 (no burning)
Water absorption ratio	GB 8810	≤3%

The data provided above are typical value, which are tested by our company. For our company’s products, the data included in the law do not have any constraints.

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