ʻO Donfoam 823PIR CP/IP kumu hoʻohui polyols no ka hoʻomau PIR poloka pahu
ʻO Donfoam 824PIR HFC-245fa kumu hoʻohui polyols no ka hoʻomau PIR poloka pahu
OLELO HOOLAHA
Donfoam823 hui polyether polyol hoʻohana CP a CP / IP e like me ka mea puhi, i hoʻohana 'ia i ka hana o ke ahi kiʻekiʻe retardant PIR poloka pahu, me ka hana o ka like pū me ka pahu hopu, haʻahaʻa thermal conductivity, maikaʻi thermal insulation a me ke ahi kiʻekiʻe retardant, haʻahaʻa wela no shrinking māwae etc.
KA WAIWAI KINO
| Ka nana aku ʻO ka viscosity dynamic （25℃） mPa.S Māmā (20 ℃) g/ml ʻO ka mahana mālama ℃ Mahina kūpaʻa mālama | ʻO ka wai aniani melemele māmā a ʻeleʻele 500±100 1.20±0.1 10-25 6 |
KAUKAU LAHUI
| Nā mea | PBW |
| DK-1103 Hoʻohui i ka Polyether Polyol CP a i ʻole CP/IP Isocyanate | 100 11-13 165-175 |
ʻenehana a me ka hoʻokō(ʻokoʻa ka waiwai pololei ma muli o nā kūlana hana)
| Hoʻohui lima | |
| Ka Mahana Makana ℃ Ka Mahana Mold ℃ CT s GT s TFT s Kūʻokoʻa Kūʻokoʻa kg/m3 | 20-25 Ka Mahana Pahu (15-45 ℃ ) 35-60 140-200 240-360 28-35 |
HANA HUA
| 'ikamu | Kūlana hoʻāʻo | Hōʻike |
| Ka nui o ka molding Density Molding Core Density | ASTM D1622 | ≥50kg/m3 ≥40kg/m |
| Paʻa-paʻa kelepona | ASTM D2856 | ≥90% |
| Hoʻomaka Thermal Conductivity（15℃） | ASTM C518 | ≤24mW/(mK) |
| Ka ikaika hoʻopili | ASTM D1621 | ≥150kPa |
| Paʻa Paʻa 24h -20 ℃ RH90 70 ℃ | ASTM D2126 | ≤1% ≤1.5% |
| Ka Pahu Wai | ASTM D2842 | ≤3% |
| Ka hikiwawe | ASTM D1692 | Ke kinai iho |
