China Donfoam 823PIR CP/IP motheo oa motsoako oa polyols bakeng sa PIR thibela foam e tsoelang pele Moetsi le Mofani oa thepa

Donfoam 823PIR CP/IP base blend polyols bakeng sa foam e sa khaotseng ea PIR block

Donfoam 823PIR CP/IP base blend polyols bakeng sa PIR block foam e tsoelang pele

Tlhaloso e Khutšoanyane:

Donfoam823 kopanya polyether polyol sebelisa CP kapa CP/IP e le ho bululela moemeli, sebelisoa ka tlhahiso ea phahameng lelakabe retardant PIR thibela foam, le litšoantšiso tsa junifomo foam sele, tlaase mogote conductivity, molemo mogote insulation le phahameng lelakabe retardant, mocheso tlaase ha ho ho fokotseha ho phatloha joalo-joalo E sebelisoa haholo ts'ebetsong ea ts'ebetso ea ts'ebetso ea liphaephe tse kholo, mefuta e mengata ea ho boloka lerako, mefuta e mengata ea ho boloka lerako: etc.

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Donfoam 824PIR HFC-245fa base blend polyols bakeng sa foam e tsoelang pele ea PIR block

LIEKETSENG

LETLOTLO MONAKA

Ponahalo

Viscosity e matla (25℃) mPa.S

Boima ba 'mele (20℃) g/ml

Mocheso oa polokelo ke ℃

Khoeli ea botsitso ba polokelo

Seedi se bonaletsang se serolwana ho isa ho sootho

500±100

1.20±0.1

10-25

RETS'ELISITSOE LEBAKA

Lintho

PBW

DK-1103 Blend Polyether Polyol

CP kapa CP/IP

Isocyanate

100

11-13

165-175

THEKNOLOJI LE TS'EBETSO(theko e nepahetseng e fapana ho latela maemo a ts'ebetso)

Ho Kopanya ka Matsoho

Raw Material Mocheso ℃

Mould Mocheso ℃

CT s

GT s

TFT s

Mahala Density kg/m³

20-25

Thempereichara e Ambient (15-45℃)

35-60

140-200

240-360

28-35

LITŠOANTŠISO TSA LEFULU

Ntho	Tekanyetso ea Teko	Tlhaloso
Kakaretso Molding Density Molding Core Density	ASTM D1622	≥50kg/m³ ≥40kg/m
Sekhahla sa lisele tse koetsoeng	ASTM D2856	≥90%
Thermal Conductivity ea pele (15℃)	ASTM C518	≤24mW/(mK)
Matla a Khatellang	ASTM D1621	≥150kPa
Botsitso ba Dimensional 24h -20 ℃ RH90 70℃	ASTM D2126	≤1% ≤1.5%
Sekhahla sa ho Monyeha ha Metsi	ASTM D2842	≤3%
Ho chesa	ASTM D1692	Boiketsi ba ho tima