I-Donfoam 825PIR HFC-365mfc base blend polyols ye-PIR block foam eqhubekayo
I-Donfoam 825PIR HFC-365mfc base blend polyols ye-PIR block foam eqhubekayo
ISINGENISO
I-Donfoam825 ihlanganisa i-polyether polyol esetshenziswa ekwenzeni i-PIR block foam ene-HFC-365mfc/227 njenge-ejenti eyenza amagwebu, imikhiqizo kanye nokusabela kwe-isocyanate ngokwakhiwa kwegwebu ine-foam cell cell , ukuqhutshwa kokushisa okuphansi, ukusebenza kokushisa okushisayo kuhle, ukushisa okuphansi kokushisa okuphansi okusetshenziselwa ukuchithwa kwe-wish, i-retardant ephansi yokushisa esetshenziswayo i-Wish isebenza kahle. zonke izinhlobo zomsebenzi wokufaka izinto ezifana: ukwakha udonga lwangaphandle, ukugcinwa okubandayo, amathangi, amapayipi amakhulu njll.
IMPAHLA YOMNYAMA
| Ukubukeka | Uketshezi olukhanyayo oluphuzi kuya kokunsundu |
| I-viscosity enamandla (25℃) mPa.S | 300±100 |
| Ukuminyana (20℃) g/ml | 1.20±0.1 |
| Izinga lokushisa lesitoreji ℃ | 10-25 |
| Inyanga yokuzinza kwesitoreji | 6 |
ISILINGANISO ESINCONYWAYO
| Ama-Raw material | pbw |
| I-DK-1101 Blend Polyether Polyol | 100 |
| Isocyanate | 180±20 |
UBUCHWEPHESHE KANYE NE-REACTIVITY(inani eliqondile liyahlukahluka kuye ngezimo zokucubungula)
| Izinto | Ukuxuba ngezandla | Umshini wokucindezela okuphezulu |
| Izinga lokushisa lempahla eluhlaza ℃ | 20-25 | 20-25 |
| Izinga lokushisa lesikhunta ℃ | 50-60 | 50-60 |
| Isikhathi sokhilimu s | 25-35 | 20-30 |
| Isikhathi se-gel s | 90.-130 | 70-100 |
| Thatha isikhathi samahhala s | 150-200 | 120-160 |
| Ukuminyana kwamahhala kg/m3 | 28-30 | 27-29 |
IMISEBENZI YEFOMU YEMACHINERY
| Ukuminyana kwe-Mold sekukonke | GB 6343 | ≥45kg/m3 |
| I-Molding Core Density | ≥40kg/m3 | |
| Isilinganiso Seseli Elivaliwe | I-GB 10799 | ≥90% |
| I-Intial Thermal Conductivity (15℃) | GB 3399 | ≤24mW/(mK) |
| Amandla Acindezelayo | I-GB/T8813 | ≥150kPa |
| Ukuzinza kweDimentional 24h -20℃ 24h70℃ | I-GB/T8811 | ≤1% ≤1.5% |
| Izinga Lokumunca Amanzi | I-GB 8810 | ≤3% |
| Ukuvutha | GB 8624 | B1/B2/B3 |
| Isilinganiso Seseli Elivaliwe | I-GB 10799 | ≥90% |
| I-Intial Thermal Conductivity (15℃) | GB 3399 | ≤24mW/(mK) |
Idatha enikezwe ngenhla yinani elijwayelekile, elihlolwa inkampani yethu. Ngemikhiqizo yenkampani yethu, idatha efakwe emthethweni ayinazo izithiyo.
