ʻO Donfoam 825PIR HFC-365mfc kumu hoʻohui polyols no ka hoʻomau PIR poloka pahu

ʻO ka wehewehe pōkole:

Donfoam825 hui polyether polyol i hoʻohana 'ia i loko o ka hana ana i ke ahi kiʻekiʻe retardant PIR poloka pahu me ka HFC-365mfc/227 e like me ka huʻihuʻi , nā huahana a me ka isocyanate pane ma ka hoʻokumu 'ana o ka huʻihaʻa ua like pū pahu, haʻahaʻa thermal conductivity, thermal insulation hana maikaʻi, ahi retardant hana maikaʻi i loko o ke ahi retardant hana o ka maikaʻi, haʻahaʻa wela hoʻohana 'ole kaʻina hana o ka shrinking hana a pau. e like me: ke kūkulu ʻana i ka pā o waho, ka mālama anuanu, nā pahu, nā paipu nui etc.


Huahana Huahana

Huahana Huahana

ʻO Donfoam 825PIR HFC-365mfc kumu hoʻohui polyols no ka hoʻomau PIR poloka pahu

OLELO HOOLAHA

Donfoam825 hui polyether polyol i hoʻohana 'ia i ka hana 'ana i ke ahi kiʻekiʻe retardant PIR poloka pahu me ka HFC-365mfc/227 e like me ka huahuakai, nā huahana a me ka isocyanate pane ma ka hookumu ana o ka huʻihuʻi puʻupuʻu pūnae hae, haʻahaʻa thermal conductivity, thermal insulation hana maikaʻi, ka lapalapa ahi retardant hana maikaʻi, haʻahaʻa wela hoʻohana 'ole ka hana o ka shrinking hana a pau. e like me: ke kūkulu ʻana i ka pā o waho, ka mālama anuanu, nā pahu, nā paipu nui etc.

KA WAIWAI KINO

Ka nana aku

ʻO ka wai aniani melemele māmā a ʻeleʻele

ʻO ka ʻeleʻele dynamic (25 ℃) mPa.S

300±100

Māmā (20 ℃) ​​g/ml

1.20±0.1

ʻO ka mahana mālama ℃

10-25

Mahina kūpaʻa mālama

6

KAUKAU LAHUI

Mea maka

pbw

DK-1101 Hoʻohui i ka Polyether Polyol

100

Isocyanate

180±20

ʻenehana a me ka hoʻokō(ʻokoʻa ka waiwai pololei ma muli o nā kūlana hana)

Nā mea

Hui lima lima

mīkini paʻi kiʻekiʻe

ʻO ka wela o ka mea maka ℃

20-25

20-25

ʻO ka mahana wela ℃

50-60

50-60

Klima manawa s

25-35

20-30

ʻO ka manawa gel s

90.-130

70-100

Tack manawa kūʻokoʻa s

150-200

120-160

Kūʻokoʻa kūʻokoʻa kg/m3

28-30

27-29

NA HANA HUA MINI

Ka nui o ka mold density GB 6343

≥45kg/m3

Molding Core Density

≥40kg/m3

Paʻa-paʻa kelepona GB 10799 ≥90%
Hoʻomaka Thermal Conductivity(15℃) GB 3399

≤24mW/(mK)

Ka ikaika hoʻopili GB/T8813

≥150kPa

ʻO ke kūlana kūpaʻa 24h -20 ℃

24h 70 ℃

GB/T8811

≤1%

≤1.5%

Ka Pahu Wai GB 8810

≤3%

Ka hikiwawe GB 8624

B1/B2/B3

Paʻa-paʻa kelepona GB 10799

≥90%

Hoʻomaka Thermal Conductivity(15℃) GB 3399

≤24mW/(mK)

ʻO ka ʻikepili i hāʻawi ʻia ma luna nei he waiwai maʻamau, i hoʻāʻo ʻia e kā mākou hui. No nā huahana o kā mākou hui, ʻaʻohe palena o ka ʻikepili i loko o ke kānāwai.


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